1. 2. 3. material content data sheet sales product name bsd316sn h6327 issued 29. august 2013 ma# MA000974354 package pg-sot363-6-6 weight* 6.66 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal tin 7440-31-5 0.002 0.03 311 noble metal gold 7440-57-5 0.008 0.12 1204 inorganic material silicon 7440-21-3 0.122 1.84 1.99 18367 19882 leadframe inorganic material silicon 7440-21-3 0.001 0.01 99 non noble metal titanium 7440-32-6 0.003 0.05 494 non noble metal chromium 7440-47-3 0.010 0.15 1482 non noble metal copper 7440-50-8 3.275 49.16 49.37 491802 493877 wire non noble metal copper 7440-50-8 0.050 0.76 0.76 7568 7568 encapsulation organic material carbon black 1333-86-4 0.029 0.44 4352 plastics epoxy resin - 0.623 9.36 93563 inorganic material silicondioxide 60676-86-0 2.246 33.73 43.53 337262 435177 leadfinish non noble metal tin 7440-31-5 0.213 3.20 3.20 32016 32016 plating noble metal silver 7440-22-4 0.076 1.15 1.15 11480 11480 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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